Semiconductor Packaging Expert in Microelectronics

A semiconductor packaging expert was sought for a patent infringement case focusing on flash storage cards used widely in consumer electronics devices. The plaintiff was a global independent semiconductor company that develops and delivers semiconductor solutions across the spectrum of microelectronics applications. Defendant designed, developed, manufactured, and marketed flash storage card products used in a variety of electronic systems.

Flash storage cards are data storage devices which allow data to be stored in a compact, removable format. They are used in digital cameras, cell phones, MP3 players, etc. The invention also relates to a method of manufacturing such a semiconductor device.

Experts Presented:

Electronic Packaging Expert

This electronic packaging expert earned a Ph.D. in Mechanical Engineering and provides technical consulting to clients across the microelectronics industry. His research interests cover various multi-disciplinary aspects of electronics packaging. He is quite familiar with emerging packaging and soldering technologies. He has consulted on the physical design of a variety of components and small to large circuit boards. His current research interests are in the areas of flip-chip assemblies, chip scale packages, lead-free material properties and lead-free assembly reliability. IMS Reference #4989582

Integrated Circuit (IC) Packaging Expert

This semiconductor packing expert has his Ph.D. in Ceramic and Industrial Engineering. His prior experience includes over thirty years in the integrated circuit packaging industry. He has also worked as an independent consultant in the semiconductor packaging industry. He has been a member of the Materials Science and Engineering Department Advisory Board since its inception and sits on several boards and committees in the semiconductor packaging industry. IMS Reference #4989584

Microelectronics Expert

This microelectronics expert holds 12 US patents, with eight pending, and a has a Ph.D. in physics and mechanics of materials. He is renowned for his expertise in the field of microelectronics and photonics packaging, specifically physical design, and the mechanics and mechanical behavior of polymeric materials for microelectronics and photonics applications. His contributions to the discipline are well-documented in 18 books and conference proceedings, five book chapters, and the nearly 250 technical articles that he has authored, co-authored, edited, or co-edited on microelectronics subjects. IMS Reference #4989622