Electronic Packaging Expert
This electronic packaging expert earned a Ph.D. in Mechanical Engineering and provides technical consulting to clients across the microelectronics industry. His research interests cover various multi-disciplinary aspects of electronics packaging. He is quite familiar with emerging packaging and soldering technologies. He has consulted on the physical design of a variety of components and small to large circuit boards. His current research interests are in the areas of flip-chip assemblies, chip scale packages, lead-free material properties and lead-free assembly reliability.
IMS Reference #4989582
Integrated Circuit (IC) Packaging Expert
This semiconductor packing expert has his Ph.D. in Ceramic and Industrial Engineering. His prior experience includes over thirty years in the integrated circuit packaging industry. He has also worked as an independent consultant in the semiconductor packaging industry. He has been a member of the Materials Science and Engineering Department Advisory Board since its inception and sits on several boards and committees in the semiconductor packaging industry.
IMS Reference #4989584
This microelectronics expert holds 12 US patents, with eight pending, and a has a Ph.D. in physics and mechanics of materials. He is renowned for his expertise in the field of microelectronics and photonics packaging, specifically physical design, and the mechanics and mechanical behavior of polymeric materials for microelectronics and photonics applications. His contributions to the discipline are well-documented in 18 books and conference proceedings, five book chapters, and the nearly 250 technical articles that he has authored, co-authored, edited, or co-edited on microelectronics subjects.
IMS Reference #4989622