Expert Profile |
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This integrated circuit (IC) packaging expert has more than 30 years in the IC packaging industry. His experience within the IC packaging industry includes co-founding a company and holding executive positions such as Vice President, Chief Technical Officer and Vice President of Operations. He is a semiconductor industry veteran with over forty years of experience in IC packaging.
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Expert Witness Experience
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- Testified in deposition and at trial
- Expert reports
- Consulting
- Served in four patent infringement cases relating to semiconductor chip packaging
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Industry Experience
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- Member of the Materials Science and Engineering Department Advisory Board
- Multiple U.S. patent holder on IC packaging
- Independent IC packaging consultant
- Author of multiple articles on IC packaging
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Educational Background
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- Ph.D., Ceramic Engineering
- M.S., Ceramic Engineering
- B.S., Ceramic Engineering
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