Integrated Circuit Packaging Expert

Case Description:

An integrated circuit packaging expert was sought for a patent infringement case before the ITC involving materials science technology used in the manufacture of electronics and microelectronics. Specifically, the patent addressed methods of integrated circuit packaging involving ball bonding and TAB bonding techniques. The patented technology minimized the risk of damaging electrostatic discharge, known as ESD. Claimant alleged that the defendants infringed on its patents by importing and selling hard disk drives, and devices using hard disk drives that are made offshore using methods and equipment that infringe on their technology.

The clients asked IMS ExpertServices to locate an expert in integrated circuit packaging with extensive knowledge of and experience with integrated circuit fabrication techniques such as ball bonding and TAB bonding. The expert was needed to consult on the dissipative properties of ceramic materials for the prevention of electrostatic discharge.

Experts Presented:

  • Microelectronics Expert

    This integrated circuit packaging expert has over 40 years of experience in both industry and academics in the materials science and engineering field. His current research is in the areas of materials and processing science for interconnect and packaging for microelectronics. He has published more than 300 reviews and journal articles in the areas of thin films and materials science for microelectronics. He is the named co-inventor on 12 U.S. Patents in microelectronics technology. He is a Fellow of the American Physical Society, the American Vacuum Society and IEEE. He is an experienced expert witness who has given testimony in deposition and at trial.IMS Reference #5001125

  • Optoelectronics Expert

    This expert in integrated circuit packaging has over twenty years of experience in electronic and optoelectronic packaging for industry leaders. He specialized in electronic and optoelectronic packaging while with one such leader. Currently he is a professor at a major university teaching courses ranging from electronics packaging, materials science, and physics, to mechanical engineering and science. He is the editor and author of numerous publications on electronics packaging. He holds four degrees including a Ph.D in materials science and is a licensed professional engineer.IMS Reference #5015309

  • Microelectronics Packaging Expert

    This IC packaging expert has over 30 years of experience in the microelectronics field and is a specialist in solid state physics, electronic devices, packaging, and reliability. He is currently on staff with a major university where he has headed several departments. He is a Fellow of IMAPS - The International Microelectronics and Packaging Society, a Fellow of the IEEE, and a past member of the Board of Governors of the IEEE's Components Packaging and Manufacturing Technology, or CPMT, Society. He has a B.S. and a Ph.D. in electrical engineering.IMS Reference #5026540

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